3d Stacked Integration

3D stacked integration is a semiconductor manufacturing technique that involves stacking multiple layers of transistors, memory, and other components on top of each other to create a more compact and powerful electronic device. As the demand for smaller, faster, and more energy-efficient electronics continues to grow, 3D stacked integration is becoming increasingly relevant to the tech community, enabling the development of innovative applications such as artificial intelligence, Internet of Things (IoT) devices, and high-performance computing systems.