Diamond Thermal Conductivity: a New Era in Chip Cooling
Posted3 months agoActive2 months ago
spectrum.ieee.orgTechstory
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Diamond Thermal ConductivityChip CoolingSynthetic Diamonds
Key topics
Diamond Thermal Conductivity
Chip Cooling
Synthetic Diamonds
The article discusses the potential use of diamond thermal conductivity for chip cooling, sparking a discussion about the novelty of the research and existing industrial applications of synthetic diamonds.
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Oct 20, 2025 at 1:48 PM EDT
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ID: 45646867Type: storyLast synced: 11/20/2025, 4:47:35 PM
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As long as you don’t use it on a gas stove, you should be fine.
Or you mean it'll catch fire? Also not a concern. That is supposed to happen at a temperature well above anything useful for cooking.
Should be safe on electrical stoves though.
There are some heady boundary-layer effects and temperature/temp-conductivity gradient physics involved here. For simplicity sake, consider a plastic [1] bag full to the brim with water, held over open flame. Will bag melt (oxidize, erode)?
[1] polyethylene melts around 120-ish °C and ignites around 220-350 °C (sources vary)
Not any more, their quality has increased recently. Not that I care, wife and I did without them during our engagement.
https://www.theguardian.com/technology/2014/feb/10/sapphire-...
In short, I my watch has NOT had an easy life. I've made no attempt to protect it or taken it off for anything except charging. There is barely a mark on the screen. A sapphire screen will be a hard requirement for my next watch.
This is my second sapphire Garmin, and it's absolutely worth the premium.
Ever consider carrying a protein bar or two?
As for a reflective screen, the term for that is "shiny", and could be marketed as desirable - it signals that the owner has an expensive watch. It wouldn't interfere with use, unless the user was wearing a bright headlamp.
Part of the argument is that better heat conduction means that you can run the nozzle cooler resulting in less heat conduction to the cold side (above where you want the filament to melt) so I guess its "cooling" in a sense too.
A little unlike IEEE to be nearly half a decade out of the loop.
From what I understand their idea seems to be that since most heating occurs at channels they act like hotspots and therefore it would be much better to drain away heat from them directly.
This is different from creating transistors on a diamond substrate.
Wait a minute, others have been doing this already: https://www.df.com/
How is this different?
See also: https://youtu.be/ggQKZDZsDec
No idea if it actually matters. Is this a single digit percentage increase in thermal conductivity by messing with a finicky, temperamental process? I don't know. What the paper writers are proposing is under the limit of when transistor structures break down, but not by much.