Imec's Superconducting Chips to Shrink Power Usage 100x (2024)

OpenAI and Nvidia's 10GW datacenter agreement and Sam Altmans new blog post wanting to build 1GW of infra a week made me think of this article again and to post it up.

Here's a couple of interesting paragraphs from it.

  Instead of the transistor, the basic element in superconducting logic is the Josephson-junction.
  
  For logic, a Josephson-junction loop without a persistent current indicates a logical 0, while a loop with one single flux quantum’s worth of current represents a logical 1. For memory, two Josephson junction loops are connected together. An SFQ’s worth of persistent current in the left loop is a memory 0, and a current in the right loop is a memory 1.
  
  In classical CMOS-based technology, it is very challenging to stack computational chips on top of each other because of the large amount of power, and therefore heat, that is dissipated within the chips. In superconducting technology, the little power that is dissipated is easily removed by the liquid helium. Logic chips can be directly stacked using advanced 3D integration technologies resulting in shorter and faster connections between the chips, and a smaller footprint.
  
   It is also straightforward to stack multiple boards of 3D superconducting chips on top of each other, leaving only a small space between them. We modeled a stack of 100 such boards, all operating within the same cooling environment and contained in a 20- by 20- by 12-centimeter volume, roughly the size of a shoebox. We calculated that this stack can perform 20 exaflops (in BF16 number format), 20 times the capacity of the largest supercomputer today. What’s more, the system promises to consume only 500 kilowatts of total power. This translates to energy efficiency one hundred times as high as the most efficient supercomputer today.